Standard BGA Heat Sink

Extruded BGA heat sinks use high thermal conductivity aluminum alloy (with a thermal conductivity of approximately 209 W/mK for A6063) and anodized surface treatment to produce cost-effective heat sinks. They are widely used as quick solutions for BGA / FPGA devices. These BGA heat sinks are installed using thermal adhesive tape, providing optimal cooling efficiency for various package sizes and airflow conditions.

We have over 10 years of experience in manufacturing BGA heat sinks with the specifications listed below, and we maintain a large inventory for long-term availability.